ISTIIS 2023 : International Symposium on Technological Innovations for Industry and Society

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International Symposium on Technological Innovations for Industry and Society (ISTIIS 2023)
Special Session at International Conference on Advanced Research in Technologies, Information, Innovation and Sustainability (ARTIIS 2023)
October 18-20, 2023, Madrid, Spain.
Webpage: https://www.artiis.org/special-sessions_1/istiis-2023
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IMPORTANT DATES
Paper submission: July 23, 2023
Notification of paper acceptance: July 30, 2023
Camera-ready papers deadline: August 15, 2023
Conference dates: October 18-20, 2023

IMPORTANT NEWS
- CCIS Proceedings (Springer)
- Best papers will be invited to SCImago journals or books

INTRODUCTION
Technological innovations have played a significant role in shaping industries and societies across the globe. These innovations have transformed how we live, work, communicate, and conduct business. Technological innovations play a critical role in driving progress and growth in industry and society. However, it is essential to recognise that technology encompasses more than just Information Technology (IT). There are a variety of technological solutions that have the potential to create positive impacts on industry and society, whether they involve digital technologies or not, like AI, ML, and IoT, or non-digital technologies, such as technical materials, sustainable and circular economy technologies, and medical and healthcare innovations.

Although many of these solutions are investigated, they are not being disseminated. To answer this gap, the International Symposium on Technological Innovations for Industry and Society (ISTIIS) aims to gather industry and academy researchers, practitioners, and experts to discuss and showcase innovative technology solutions that positively impact industry and society. ISTIIS is a platform for knowledge sharing, receiving feedback, collaboration, and networking among researchers, practitioners, and industry experts. The symposium is focused on showcasing practical solutions attained from research and innovative processes that can address the challenges faced by industry and society.

The symposium invites submissions of original research papers, case studies, reviews, and surveys on innovative technological solutions in various industries that address the challenges faced by society.


TOPICS OF INTEREST
Innovative and exciting practical contributions are welcome within the following topics:
• Industry 4.0 and digital transformation.
• Artificial Intelligence (AI) and Machine Learning (ML) applications.
• Internet of Things (IoT) and its role in Industry and Society.
• Sustainable and circular economy solutions.
• Robotics and automation in industry and their impact on employment and work environment.
• Big data and data analytics for decision-making.
• Gamification and serious games for education, health, social or organisational impact.
• Smart Cities and urban planning.
• Medical and healthcare technology innovations.
• Emerging technologies and their potential for transforming industry and society.
• Blockchain technology and its applications.
• Cybersecurity and data protection.
• Technical materials.


PAPER SUBMISSION
Authors must submit an original paper that has not previously been published. All papers must follow the Springer template (https://drive.google.com/file/d/1ORPTQ4VfT4qPm-lBsG53FTXijTU9r-Jo/view ) and be submitted in LaTeX or MSWord format (http://www.springer.com/la/computer-science/lncs/conference-proceedings-guidelines) through EasyChair submission system (https://easychair.org/account/signin?l=UWEaKYRy5OaBpQb9NPqMaS). Submissions must be original and can be of two types: full paper (full-length) papers should not exceed twelve (15) pages in length, whereas short papers should not exceed six (11) pages. Springer encourages authors to include their ORCIDs in their papers. In addition, the corresponding author of each accepted paper, acting on behalf of all of the authors of that paper, must complete and sign a Consent-to-Publish form, through which the copyright for their paper is transferred to Springer.

In this first phase, the papers cannot have the authors' names or their affiliations.

Each submission will be peer-reviewed by at least two members of the Program Committee. The reviewing process is double-blind. The best-accepted papers will appear in the proceedings published by Springer in the Communications in Computer and Information Science series.

*Authors of the best papers presented at the ISTIIS symposium will be invited to submit extended versions of their manuscripts for a Special Issue in the journal SN Applied Sciences (Springer), EAIN Book (Springer), Journal of Future Internet (MDPI) or at other ASTIIS submission process.

ORGANISING COMMITTEE
Filipe Portela ([email protected])
Rita Miranda ([email protected])