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ENGINEERING
ELECTRONIC PACKAGING
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Call for Papers |
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It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2024 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
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Summary |
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InterPACK 2024 : International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems will take place in San Jose, CA. It’s a 3 days event starting on Oct 8, 2024 (Tuesday) and will be winded up on Oct 10, 2024 (Thursday). InterPACK 2024 falls under the following areas: ENGINEERING, ELECTRONIC PACKAGING, etc. Submissions for this Conference can be made by Feb 19, 2024. Please check the official event website for possible changes before you make any travelling arrangements. Generally, events are strict with their deadlines. It is advisable to check the official website for all the deadlines. Other Details of the InterPACK 2024
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Credits and Sources |
| [1] InterPACK 2024 : International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems |
