The 2019 IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity. 2019 INTERCON will be held in Lima, Peru, the Gastronomic Capital of Latin America and World Heritage Site by UNESCO. Museums with great works of art, archaeological sites, beaches, the boardwalk, valleys, natural reserves, the nightlife, the thrill of adventure sports, and the exquisite cuisine gives Peru’s capital an authentic personality and makes tourism in Lima a unique experience in the country. 2019 INTERCON will be hosted at the Universidad Autonoma del Peru in Villa El Salvador, an urban, largely residential coastal district on the outskirts of Lima. Topics of interest include but are not limited to: Communication systems Semiconductor and devices Computers and information technology Signal processing Systems and control Emerging technologies Circuits and systems Power generation, transmission and distribution Renewable energy sources, smartgrids technologies and applications Power electronics, systems and applications Electrical machines and adjustable speed drives High voltage engineering and insulation technology Algorithms and complexity Architecture and organization Graphics and visualization Information management, assurance and security Intelligent systems Parallel and distributed Computing Software engineering Social issues and professional practice Submission The official language of INTERCON is ENGLISH. The maximum number of authors per paper is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at: https://www.ieee.org/conferences/publishing/templates.html We will use EasyChair system for submissions here: https://easychair.org/conferences/?conf=2019ieeeintercon Registration Every accepted paper will need one associated full registration for being included in the conference technical program and proceedings. Publication As it is mandatory for any IEEE conference, we will implement a strict “No Show No Publication” policy, meaning that accepted papers that are not presented at the conference will not be submitted for publication in IEEE Xplore. Such presentations must be done on-site, so participants and authors can talk and interchange their experiences and views. Face-to-face technical discussions are a precious element of quality of our conference. All the papers submitted through EasyChair will be peer reviewed and all of the accepted papers, if they are presented at 2019 INTERCON, will be submitted for publication in IEEE Xplore. Important dates Full paper submission deadline: May 15 Notification of acceptance: June 15 Final paper submission deadline: June 30 Conference dates: August 12-14 Organizing Committee Conference Chair: César Gallegos cgallegos@ieee.org Technical Program Chair: Carlos Silva csilva@pucp.edu.pe Publication Chair: Álvaro Talavera ag.talaveral@up.edu.pe Conference Treasurer: Isaac Castillo Isaac.castillo.la@ieee.org Information Contact: José Durán joseduran@ieee.org Sponsored by: IEEE Peru Section (www.ieee.org.pe) Supported by: Universidad Autonoma del Peru IEEE Student Branch
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