 AQ-IoT 2023 : Intelligent and Trustworthy Internet of Things Systems: Architectures and QualitiesNagoya University, Japan |
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| When: Nov 7, 2023 - Nov 7, 2023 Submission Deadline: Sep 20, 2023 | ||
| AQ-IoT 2023 - CfP • Intelligent and Trustworthy Internet of Things Systems: Architectures and Qualities • https://mau.se/en/calendar/intelligent-and-trustworthy-internet-of-things-systems... | ||
| IOT ARCHITECTURE QUALITY TRUSTWORTHYNES | ||
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| When: Mar 15, 2024 - Mar 17, 2024 Submission Deadline: Jan 15, 2024 | ||
| Full name：2024 11th International Conference on Geological and Civil Engineering • Abbreviation：ICGCE 2024 • 2024 11th International Conference on Geological and Civil Engineering (IC... | ||
| CIVIL ENGINEERING ARCHITECTURE ENVIRONMENT NANOTECHNOLOGY | ||
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| When: Feb 26, 2024 - Feb 29, 2024 Submission Deadline: Jan 11, 2024 | ||
| Full Name: 2024 9th International Conference on Building Materials and Construction (ICBMC 2024) • Abbreviation: ICBMC 2024 • 2024 9th International Conference on Building Materials and C... | ||
| ARCHITECTURE CIVIL ENGINEERING MATERIALS NANOTECHNOLOGY | ||
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| When: Mar 17, 2023 - Mar 20, 2023 Submission Deadline: Nov 5, 2022 | ||
| Full Name: 2023 8th International Conference on Building Materials and Construction (ICBMC 2023)--EI Compendex, Scopus • Abbreviation: ICBMC 2023 • Venue: Kyoto, Japan • Dates: Marc... | ||
| ARCHITECTURE MATERIALS SCIENCE ENVIRONMENT NANOTECHNOLOGY | ||
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| When: Mar 17, 2023 - Mar 20, 2023 Submission Deadline: Nov 5, 2022 | ||
| Full Name: 2023 3rd International Civil Engineering and Architecture Conference (CEAC 2023)--EI Compendex, Scopus • Abbreviation: CEAC 2023 • March 17-20, 2023 | Kyoto, Japan • http... | ||
| ARCHITECTURE DESIGN ENVIRONMENT SUSTAINABLE DEVELOPMENT | ||
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| When: Mar 17, 2023 - Mar 20, 2023 Submission Deadline: Nov 5, 2022 | ||
| Full Name: 2023 3rd International Civil Engineering and Architecture Conference (CEAC 2023)--EI Compendex, Scopus • Abbreviation: CEAC 2023 • March 17-20, 2023 | Kyoto, Japan • http... | ||
| CIVIL ENGINEERING ENGINEERING MANUFACTURING NANOTECHNOLOGY | ||
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| When: Dec 7, 2022 - Dec 9, 2022 Submission Deadline: Aug 3, 2022 | ||
| ================================================================================ • The 23rd International Conference on Parallel and Distributed Computing, • Applications and Technologies... | ||
| PARALLEL COMPUTING DISTRIBUTED COMPUTING NETWORK ARCHITECTURE SECURITY AND PRIVACY | ||
COOL Chips 24 2021 : IEEE Symposium on Low-Power and High-Speed Chips and SystemsBunkyo-ku, Tokyo, Japan |
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| When: Apr 14, 2021 - Apr 16, 2021 Submission Deadline: Feb 05, 2021 | ||
| IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of mic... | ||
| COMPUTER ARCHITECTURE MICROARCHITECTURE SOFTWARE VLSI | ||
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| When: Aug 25, 2021 - Aug 27, 2021 Submission Deadline: Apr 10, 2021 | ||
| In the present century, there is a tremendous growth of each and every field of Advanced Functional Materials. ICAFM 2021 aimed at promoting research worldwide and publishes basic and advanced r... | ||
| MATERIALS SCIENCE ARCHITECTURE NANOTECHNOLOGY MECHANICAL ENGINEERING | ||
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| When: Nov 24, 2020 - Nov 27, 2020 Submission Deadline: Jul 30, 2020 | ||
| Following the success of past CANDAR symposiums 2013 in Matsuyama, 2014 in Shizuoka, 2015 in Sapporo, 2016 in Hiroshima, 2017 in Aomori, 2018 in Takayama, 2019 in Na... | ||
| PARALLEL COMPUTING NETWORKING COMPUTER ARCHITECTURE ARTIFICIAL INTELLIGENCE | ||
ASP-DAC 2021 : 26th Asia and South Pacific Design Automation ConferenceTokyo Odaiba Waterfront, Japan |
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| When: Jan 18, 2021 - Jan 21, 2021 Submission Deadline: Jul 26, 2020 | ||
| ASP-DAC 2021 is the 26th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design and fabrication of silicon chips in the w... | ||
| EMBEDDED SYSTEMS MEMORY ARCHITECTURE SYSTEM DESIGN | ||
ICBMC--EI and Scopus 2020 : 2020 5th International Conference on Building Materials and Construction (ICBMC 2020)--Ei Compendex, ScopusTokyo University of Science, Japan |
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| When: Feb 26, 2020 - Feb 29, 2020 Submission Deadline: Oct 5, 2019 | ||
| 2020 5th International Conference on Building Materials and Construction (ICBMC 2020) will be held during February 26-29, 2020 in Tokyo University of Science, Japan. • Main Attractions: • ... | ||
| MATERIALS ARCHITECTURE DESIGN ENGINEERING | ||
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| When: Jan 17, 2020 - Jan 20, 2020 Submission Deadline: Sep 30, 2019 | ||
| ★ICCBM 2020★ • KEM--2020 The 4th International Conference on Civil and Building Materials (ICCBM 2020)--EI Compendex, Scopus • ● 2020 The 4th International Conference on Civil and Bu... | ||
| ARCHITECTURE MATERIALS SCIENCE MECHATRONICS ENGINEERING | ||
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| When: Jan 17, 2020 - Jan 20, 2020 Submission Deadline: Sep 25, 2019 | ||
| KEM--2020 The 10th International Conference on Advanced Materials Research (ICAMR 2020)--EI Compendex, Scopus • 2020 The 10th International Conference on Advanced Materials Research (ICAMR 2020)... | ||
| MATERIALS MANUFACTURING ARCHITECTURE MECHANICAL ENGINEERING | ||
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| When: Jan 7, 2020 - Jan 9, 2020 Submission Deadline: Aug 30, 2019 | ||
| 2020 7th International Conference on Geological and Civil Engineering (ICGCE 2020), Kyoto, Japan, January 7-9, 2020. • Conference Website: http://www.icgce.org/ • ICGCE 2020 Shining Points... | ||
| ARCHITECTURE NANOTECHNOLOGY ENVIRONMENTAL ENGINEERING MATERIALS | ||
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| When: Dec 26, 2019 - Dec 28, 2019 Submission Deadline: Sep 10, 2019 | ||
| 2019 International Conference on Built Environment and Eco-Design (ICBEED 2019) will be held in Kyoto, Japan during Dec 26-28, 2019. • Prof Nobuo MISHIMA from Faculty of Science and Engineering,... | ||
| BUILT ENVIRONMENT ECO-DESIGN CIVIL ARCHITECTURE | ||
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| When: Oct 11, 2019 - Oct 14, 2019 Submission Deadline: Aug 20, 2019 | ||
| 2019 8th International Conference on Nanostructures, Nanomaterials and Nanoengineering (ICNNN 2019)--EI Compendex and Scopus • The 8th International Conference on Nanostructures, Nanomaterials a... | ||
| MATERIALS SCIENCE MECHANICAL ENGINEERING PHYSICS ARCHITECTURE | ||
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| When: Apr 17, 2019 - Apr 19, 2019 Submission Deadline: Feb 8, 2019 | ||
| --------------------------------------------------------------------------- • IEEE Symposium on Low-Power and High-Speed Chips and Systems, • COOL Chips 22 • Yokohama Joho Bunka Cent... | ||
| COMPUTER ARCHITECTURE MICROARCHITECTURE SOFTWARE VLSI | ||
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