| Conference Location | Auckland, New Zealand |
| Conference Date | 2019-12-12 |
| Notification Date | 2019-09-27 |
| Submission Deadline | 2019-07-30 |
| Conference Website and Submission Link | http://www.iseeie.org/ |
| CCF Ranking | |
| Core Ranking | |
| Qualis Ranking |
| Year | Submitted Papers | Accepted Papers | Accepted Percentage/Acceptance Rate |
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We are working hard to collect and update the acceptance rate details of the conferences for recent years. However, you can consider the above (if available) acceptance rates to predict the average chances of acceptance of your research paper at this conference.
ISEEIE 2019: International Symposium on Electrical, Electronics and Information Engineering submission deadline is 2019-07-30.
Note: It is generally recommended to submit your conference paper
on or before the submission deadline. Generally, conferences do not
encourage to submit the research paper after the deadline is over.
In rare scenarios, conferences extend their deadline. Decision about the
extension of the deadline is generally updated on the official conference webpage.
Notification date of ISEEIE 2019: International Symposium on Electrical, Electronics and Information Engineering is 2019-09-27.
Note: This is the date on which conference announces the result about acceptance or rejection of submitted papers. If your research paper is accepted, the conference will request you to submit the camera ready version of your research paper by the due date. Due date to submit the camera ready version of the paper is generally posted on the official web page of the conferences or notified to you via. email.
ISEEIE 2019: International Symposium on Electrical, Electronics and Information Engineering will start on 2019-12-12.
Note: This is the date on which the conference starts.
ISEEIE 2019: International Symposium on Electrical, Electronics and Information Engineering will be organized at Auckland, New Zealand. This is the place where the conference is organized and the research paper is to be presented.
