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COOL Chips 2019: IEEE Symposium on Low-Power and High-Speed Chips and Systems - Call for paper, ranking, acceptance rate, submission deadline, notification date, conference location, submission guidelines, and other important details


This article provides the call for paper, ranking, acceptance rate, submission deadline, notification date, conference location, submission guidelines, and other important details of COOL Chips 2019: IEEE Symposium on Low-Power and High-Speed Chips and Systems all at one place.

Conference Location Yokohama, Japan
Conference Date 2019-04-17
Notification Date 2019-03-15
Submission Deadline 2019-02-18
Conference Website and Submission Link http://www.coolchips.org/2019/


Conference Ranking


IEEE Symposium on Low-Power and High-Speed Chips and Systems ranking based on CCF, Core, and Qualis is shown below:

CCF Ranking
Core Ranking
Qualis Ranking

Click here to check the ranking of any conference.
  • About CCF Ranking: The Chinese Computing Federation (CCF) Ranking provides a ranking of peer-reviewed journals and conferences in the field of computer science.

  • About Core Ranking: The CORE Conference Ranking is a measure to assess the major conference in the computing field. This ranking is governed by the CORE Executive Committee. To know more about Core ranking, visit Core ranking portal.

  • About Qualis Ranking: This conference ranking is published by the Brazilian ministry of education. It uses the h-index as a performance metric to rank conferences. Conferences are classified into performance groups that range from A1 (to the best), A2, B1, B2,..., B5 (to the wost). To know more about qualis ranking, visit here

Conference Acceptance Rate


Below is the acceptance rate of IEEE Symposium on Low-Power and High-Speed Chips and Systems conference for the last few years:

Year Submitted Papers Accepted Papers Accepted Percentage/Acceptance Rate

We are working hard to collect and update the acceptance rate details of the conferences for recent years. However, you can consider the above (if available) acceptance rates to predict the average chances of acceptance of your research paper at this conference.



Conference Call for paper


COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 22 is to be held in Yokohama on April 17-19, 2019, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All papers are published online via IEEE Xplore. Especially, selected academic papers are strongly invited to submit to the special issue on COOL Chips in the IEEE Transactions on Multi-Scale Computing Systems (TMSCS), and selected commercial papers are for publication in IEEE Micro.Contributions are solicited in the following areas:
Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job title, address, phone number, FAX number, and e-mail address of the presenter. Please prepare the extended abstract using the given guidelines and template.In the extended abstract, the status of the product or topic should precisely be described. If this is a not-yet-announced product, and you would like to keep the submission confidential, please indicate it. We will do our best to maintain confidentiality.Proposals will be selected by the program committee’s evaluation of interest to the audience. Submission should be made through submission site.

Submission Deadline


COOL Chips 2019: IEEE Symposium on Low-Power and High-Speed Chips and Systems submission deadline is 2019-02-18.

Note: It is generally recommended to submit your conference paper on or before the submission deadline. Generally, conferences do not encourage to submit the research paper after the deadline is over. In rare scenarios, conferences extend their deadline. Decision about the extension of the deadline is generally updated on the official conference webpage.


Notification date


Notification date of COOL Chips 2019: IEEE Symposium on Low-Power and High-Speed Chips and Systems is 2019-03-15.

Note: This is the date on which conference announces the result about acceptance or rejection of submitted papers. If your research paper is accepted, the conference will request you to submit the camera ready version of your research paper by the due date. Due date to submit the camera ready version of the paper is generally posted on the official web page of the conferences or notified to you via. email.


Conference Date


COOL Chips 2019: IEEE Symposium on Low-Power and High-Speed Chips and Systems will start on 2019-04-17.

Note: This is the date on which the conference starts.


Conference Location


COOL Chips 2019: IEEE Symposium on Low-Power and High-Speed Chips and Systems will be organized at Yokohama, Japan. This is the place where the conference is organized and the research paper is to be presented.